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Process development in metal/BCB multilayer interconnections of MMCM with embedded chip in Si substrate
First author: Ding, XY
Abstract: A vertical interlayer connection via (VILCV) fabrication process is presented. This process is used for the interconnection of multilayer benzocyclobutene (BCB) based microwave multichip modules (MMCM). The excellent planarity of BCB allows VILCV to be fo
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Page number: 335-339
Issue: 3
Subject: Engineering, Electrical & Electronic; Nanoscience & Nanotechnology; Optics; Physics, Applied
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PubYear: 2009-3-1
Volume: 86
Unit code: 172231
Publication name: MICROELECTRONIC ENGINEERING
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